Please use this identifier to cite or link to this item: http://hdl.handle.net/10662/18331
Title: Impact of substrate and bending angle on the performance of microwave PCB sensors for permittivity measurements
Authors: Blázquez Bello, Sara
Campos Roca, Yolanda
Bangert, Axel
Sandhagen, Carl
Keywords: Evaluación no destructiva;Medición de permitividad;Placa de circuito impreso (PCB);Sensores de microondas;Electrónica verde;Electrónica flexible;Nondestructive evaluation;Permittivity measurement;Printed circuit board (PCB);Microwave sensors;Green electronics;Flexible electronics
Issue Date: 2021
Source: Blazquez-Belloa, S., Campos-Roca, Y., Bangertb, A., Sandhagen, C. (2021). Impact of substrate and bending angle on the performance of microwave PCB sensors for permittivity measurements
Abstract: A design topology for a microwave planar permittivity sensor focused on manufacturing simplicity is proposed. Its operation is based on the first-notch frequency of the reflection parameter. The impacts of substrate and bending angle on the performance of this type of sensor are comparatively analyzed. Three flexible substrates are considered in comparison to three rigid ones. By full-wave electromagnetic analysis, the sensors have been simulated in contact to a material under test with a relative permittivity ranging between 1 and 20. The resulting shifts in the first-notch frequency show the potential of flexible environmentally-friendly substrates, such as liquid crystal polymer and paper, for the development of the sensors. In the flexible cases, the bending angles have been varied from 0 to 120, producing deviations in first-notch frequency of 0.4 to 4.7%. The simulation methodology is validated by experimental characterization of a prototype on Rogers 4003C laminate.
Description: Publicado en Measurement (Volume 175, April 2021, 109114) con DOI: j.measurement.2021.109114
URI: http://hdl.handle.net/10662/18331
Appears in Collections:DTCYC - Artículos

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